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Building envelope design and modelling lab

espandiBuilding envelope design and modelling lab

Codice identificativo insegnamento: 051663
Programma sintetico:
The aim of the Building Envelope Design Lab is to provide knowledge and expertise to develop architectural surfaces from conceptual design to fabrication using advanced software and tools. Daylighting strategies are used to find envelopes able to cope with energy performance, users’ requirements and architectural integration. The course is structured in three parts: Daylighting and design of responsive skins lectures, Seminars and Student projects. Daylighting and design of responsive skins lectures: lessons will be devoted to the analysis of case studies representing the behaviour of different façade typologies, focusing on geometries and movement, users’ behaviour, daylighting simulations and construction materials and technologies. Seminars: special lectures will be carried out by academic and professional experts that works on the topic of building envelopes, biomimicry and fabrication techniques. Student projects: the practical part of the course will be related to the development of a design concept for a building located in different places of the world. Tutors will assist students during all the process that leads from the design concept to the fabrication of a model at small scale, constructed within the laboratories of the Politecnico di Milano. By the end of the course, students will demonstrate how to: - Evolve the concept by critical and technical analyses emerged during the conception of the building component/envelope. - Connect design concepts with material strategies and architectural technology. - Work with computational tools in order to facilitate the link between digital design, daylight and thermal simulations and physical construction. - Present and communicate research findings as part of a group and individually. - Contribute and share knowledge as part of an interdisciplinary professional team.

HEAT TRANSFER THROUGH WALLS Steady periodic heat transfer Parameters for dynamic heat transfer through a wall: self admittance, transfer admittance, effusivity Methods for Numerical solution of the conduction equation in walls Moisture transfer in air and by air MOISTURE MOVEMENT IN BUILDINGS - Diffusion - Convection MOISTURE TRANSFER IN POROUS MATERIALS - Diffusion - Capillarity suction --- Moisture balance for building components --- Moisture balance for ventilated spaces --- Interstitial condensation - Calculation methods for Steady conditions - Calculation methods for Dynamic conditions APPLICATIONS Examples relevant to building design, operation and refurbishment By using available software tools (e.g. WUFI) , spreadsheets, etc.

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